| 产品特性：超大尺寸 | 加工定制：是 | 品牌：超盛 |
| 型号：CSPC2876 | 机械刚性：刚性 | 层数：多层 |
| 基材：铜 | 绝缘材料：有机树脂 | 绝缘层厚度：常规板 |
| 阻燃特性：VO板 | 加工工艺：压延箔 | 增强材料：玻纤布基 |
| 绝缘树脂：环氧树脂(EP) | 产品性质：热销 | 营销方式：厂家直销 |
| 营销价格：优惠 |
32层埋槽金属包边大尺寸电路板PCB
产品名称：军用产品
板材：FR-4、TG180材质
层数：32层盲埋金属包边盲槽埋锣大尺寸电路板
最小线宽/间距：8/6mil
成品尺寸：1320x101mm/1*1PCS
表面工艺：沉金2U“
铜厚度：35um
厚度8.0mm
最小孔径：0.20mm，激光孔径0.10mm
阻抗：阻抗±10%
功能：超厚，超长，盲埋金属包边等
用途：航天，雷达，航空，通信机站等
超生集团公司主要产品结构
2-80层刚性电路板、2-50层柔性电路板和PCBA生产
超生集团公司主要生产各类产品
高端双面、多层、柔性、高频、HDI互连、金属基、高导热金属基、陶瓷、切入金属基、切入埋入电容器、切入厚铜埋入磁体、凹凸台阶基板、5G高速板、厚铜、厚金、高碳电阻、双面多层MiNiLED、MiNiHDILED、MiNiOLED、IC载体基板、卷对卷FPC、长FPC、大型印刷电路板、无卤材料、高频材料、高速材料、金属材料、环保电路板、盲埋孔电路板、高导热铝基、热电分离铜基、PDU母线、铁基和金属基（芯）混合压板、嵌入式铜埋铜。埋电阻埋电容埋陶瓷珠板、超薄BT板、陶瓷基板、IC载体板、高频混合电压、高速板、差分阻抗板、厚铜板、厚镀金板、HDI是Anylayer、双面、多层、HDI FPC、软结合HDI、卷对卷FPC、超长FPC、超大尺寸PCB生产和产品设计开发、软件开发、特殊材料印刷电路板等的集成OEM和ODM生产工厂。
超生集团公司PCB和PCBA产品的主要应用领域
通信终端、通信站、电子通信、光纤、光模块、背光源、芯片系统、通信设备、通信仪器、计算机、智能器件、智能控制、系统控制、工业电源控制、工业设备、测试仪器、测试仪器，SD卡、SG卡、手机、计算机、各种天线、雷达、汽车、光源、电阻器、音乐设备、播放设备、银行设备、医疗仪器、医疗设备、航空航天、军事、LED、OLED、OLCD电源控制电源、工业电源、通信电源、汽车电源、办公设备、数字产品、计算机等应用领域；
 Process Capability Table | ||||
| Technical ltem | MassProduct | Advanced Technology | ||
| 2015 | 2021 | 2025 | ||
| Max.Layer Count | 80 layer | 100 layer | 100 layer | |
PCB through hole board | 2～80 layer | 2～100 layer | 2～100 layer | |
Maximum size through hole 1～2 | 37〞*98.50" | 43.3〞*118.11" | 43.3〞*118.11" | |
Minimum line width and spacing | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
| Minimum mechanical hole(mm) | 12(0.50) | 10(0.40) | 8.50（0.35mm） | |
Maximum size through hole 4～22 layers | 37〞*43.30" | 43.3〞*43.30" | 43.3〞*43.30" | |
Maximum size through hole 4～22 layers | 31.50 ″*59" | 31.50 ″*70.86" | 31.50 ″*70.86" | |
Maximum size through hole 4～22 layers | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
| Minimum line width and spacing for multi-layer large-sized PCBs | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
Maximum size of multi-layer through- hole : 4-22 layers with the smallest hole | 12(0.50) | 10(0.40) | 8.50（0.35mm） | |
| Maximum size HDI 4～36 layers | 31.50 ″*55" | 31.50 ″*55" | 31.50 ″*55" | |
| Minimum line width and line spacing of large size PCB | Through hole 12 / 12milHDI14 /14mil | Through hole 10/10 milHDI12 / 12mil | Through hole 8 / 8milHDI12 / 12mil | |
| The largest board ruler 1 → the smallest hole of 18 layers | Through hole 0.50mmHDI :0.45mm | Through hole 0.50mm HDI : 0.45mm | Through hole 0.50mmHDI : 0.45mm | |
| The layer number of FPC | 1～36layer | 1～60layer | 1～60layer | |
| Maximum size of flexible FPC | 19.68〞*55" | 28〞*59" | 31.49〞*118.12" | |
| Maximum size of flexible FPC with soft hard combination | 19.68〞*55" | 28〞*59" | 31.49〞*118.12" | |
FPC (roll to roll) maximum size | 19.68 ″*7874" | 19.68 ″*7874" | 19.68 ″*7874" | |
Maximum size of FPC single chip shipment | 19.68 ″*118.11" | 19.68 ″*196.8" | 19.68 ″*196.80" | |
| The layer number of FPC | 2～18 layer | 2～36 layer | 2～42 layer | |
Maximum size of layered board | 19.68 ″*35" | 19.68 ″*43" | 19.68 ″*43" | |
Number of through-hole layers | 2～20layer | 2～30 layer | 2～40 layer | |
Hard and soft HDI layers | 2～14 layer | 2～18 layer | 2～22 layer | |
Maximum size of soft and hard combination | 19.68 ″*43" | 19.68 ″*49" | 19.68 ″*49" | |
FPC/soft-hard combination arbitrary interconnection HDI | 4+X+4Interconnect HDI | 5+X+5Interconnect HDI | 6+X+6Interconnect HDI | |
HDIPCB layers | 4～36layer | 4～60layer | 4～80 layer | |
Anylayer HDI PCB | 4+X+4Interconnect HDI | 5+X+5、Interconnect HDI | 8+X+8、Interconnect HDI | |
HDIPCB maximum board size | 24"*52" | 43"*49" | 43"*49" | |
Number of through hole layers of high frequency board | 2～18 layer | 2～36 layer | 2～60 layer | |
| HDI layers ofhighfrequency board | 2～16 layer | 2～24 layer | 2～60layer | |
| Maximum size of high frequency board | 37 ″*43" | 43 ″*49" | 43 ″*49" | |
Number of ceramic plates | 1-2 layer | 1～4 layer | 1～6 layer | |
Ceramic plate thickness | 0.60mm-1.60mm | 0.38mm-20.0mm | 0.38mm-20.0mm | |
Maximum size of ceramic plate | 100*150mm | 150*190mm | 150*650mm | |
Minimum aperture of ceramic plate | 0.50mm | 0.35mm | 0.35mm | |
Minimum line width and line spacing of ceramic board | 16/16mil | 12/12mil | 10/10mil | |
Number of layers of metal copper substrate | 1-2 layer | 1～4 layer | 1～6 layer | |
Maximum line width and line spacing of metal iron substrate | 12/12mil | 4/4mil | 4/4mil | |
Number of layers of metal aluminum substrateHDI | 1-2 layer | 1～4 layer | 1～6 layer | |
Maximum size of metal substrate | 37 ″*43" | 25.59 ″*59" | 25.59 ″*59" | |
| The smallest hole of the metal substrate | 0.50mm | 0.35mm | 0.35mm | |
Minimum line width and line spacing of metal substrate | 8/8mil | 4/4mil | 4/4mil | |
| Transparent FR- 4 material layers | 1-2layer | 1-2layer | 1-8layer | |
| Transparent FR-4 minimum hole | 0.35mm | 0.35mm | 0.35mm | |
| Transparent FR-4 minimum line width and spacing | 4/4Mil | 4/4Mil | 3.5/3.5Mil | |
| Transparent FR- 4 maximum size | 23.63*47.25″ | 23.63*47.25 ″ | 23.63*47.25 ″ | |
| Number of tempered glass base layers | 1-2layer | 1-2layer | 1-2layer | |
| Minimum line width and spacing of glass | 4/4Mil | 4/4Mil | 3.5/3.5Mil | |
| The smallest hole in glass | 0.35mm | 0.35mm | 0.35mm | |
| Maximum size of glass | 23.63*47.25″ | 23.63*47.25 ″ | 23.63*47.25 ″ | |
| Number of layers of transparent PETmaterial | 1-2layer | 1-2layer | 1-2layer | |
| Maximum size of transparent PET | 19.68 ″*7874" | 19.68 ″*7874" | 19.68 ″*7874" | |
The company&＃39;s main product types | Halogen free materials, high TG materials, high-frequency materials, high-speed materials, metal materials, glass materials, embedded materials, transparent FR- 4 materials, high thermal conductivity metals, high thermal conductivity aluminum substrates, environmentally friendly circuit boards, BT materials, ABF materials, and other imported materials, DU busbars, iron-based and metal based (core) mixed pressure plates, embedded buried copper, buried resistors, buried capacitors, buried ceramic bead plates, buried ceramics, ceramic mixed pressure plates, multi-layer ceramics, ultra-thin BT plates, ultra-thin PCBs, ultra-thin PCBs, multi-layer aluminum substrates, multi-layer ceramic plates, multi-layer ultra-thin HDI、 High frequency mixed voltage, differential impedance board, thick copper plate, gold-plated plate, high and low copper, high and low copper, high carbon resistance, transparent multilayer, glass plate, HDI arbitrary order (cross blind buried) Anylayer, flexible double-sided, flexible multilayer, soft hard combination HDI, roll to roll FPC, ultra long size, ultra large size board (single, double, multi-layer) PCB production and product design, product development, software development, etc | |||
| Main material | Rogers, Taikoni, Yaron, Mitsui, ***la, 3M, Taiyao, Taiguang, Tenghui, Shengyi,Lianmao, Nanya, Doosan, DuPont, Taihong, Hongren, Xinyang, Nippon Steel, Teflon,Yasen, Panasonic, RCC, Mitsui, Mitsubishi, Yingye, 3M, Kyocera, Jiuhao, Zhongci,Huaqing, Aishengda, Sliton, Kaichangde, Tongxin, Beige, Yalong, Taikoni,Hitachi, Laird System, etc | |||
Main material categories | Halogen-free、halogenated、 high thermal conductivity, high TG135 、TG140、 TG150、 TG170、TG180、TG240、TG320 | |||
| Build-up Material | FR-4 ，TG150,TG70,TG180 | |||
| Conventional plate thickness (mm) | Min.1-2L(mm) | 0.10mm | 0.10-12.0mm | 0.10-18.0mm |
| Min.4-10L(mm) | 0.35mm | 0.35mm～10.0mm | 0.35-18.0mm | |
| Min.12L(mm) | 0.43 | 0.38～10.0mm | 0.38～18.0mm | |
| Min.16L(mm) | 0.53 | 0.45～10.0mm | 0.45～18.0mm | |
| Min.18L(mm) | 0.63 | 0.51～10.0mm | 0.51～18.0mm | |
| Min.52L(mm) | 0.8 | 0.65～10.0mm | 0.65～18.0mm | |
| MAX(mm) | 3.5 | 12.0mm | 18.0mm | |
Copper plate thickness and copper thickness | 1-2 layerCU | 700um | 875um | 875um |
| Layers 4-20 | 4-12layer | 4-16layer | 4-22layer | |
| Inner layer copper thickness（um) | 875um | 1050um | 1225um | |
Outercopperthickness | 210um | 350um | 525um | |
Thick copper finished plate thickness | 8.0mm | 12.0mm | 18.0mm | |
| IC substrate | layerHDI | 1-10layer | 1-14layer | 1-16layer |
| Line width and spacing | 50um | 25um | 15um | |
| copper thickness | 8-10um | 10-12um | 12-15um | |
| Min.CoreThickness um(mil) | 254" (10.0) | 0.15～254(10.0mm) | 0.15～254(10.0mm) | |
| Min.Build up Dielectric | 38(1.5) | 25(1.0) | 25(1.0) | |
BaseCopperWeigh t | Inner Layer | 1/4-8 OZ | 1/4-0.30mm | 1/4-0.30mm |
| Out Layer | 1/4-10 OZ | 1/4-30 OZ | 1/4-30 OZ | |
| Gold thick | 1～40u" | 1～200u" | 1～200u" | |
| Nithick | 76～127u" | 1～250u" | 1～250u" | |
Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | |
Min. IVH、Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
| DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | |
| 125(5) | 125(5) | 125(5) | ||
| SKipvia | Yes | Yes | Yes | |
| viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | |
| Laser Hole Filling | Yes | Yes | Yes | |
| Technicalltem | MassProduct | Advanced Technology | ||
| Hole depth/diameter | Through Hoie | 25:01 :00 | 35:01 :00 | 40:01 :00 |
| AspctRatio | MicroVia | 0.8 :1 | 0.8 :1 | 0.8 :1 |
| copperFilling Dimple Size | 10(0.40) | 5(0.20) | 5(0.20) | |
Minimumouter line width/ spacing | Inner layer line width and spacing | 38/38(1.5/1.5) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
PlatedLayerum(mil) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |
| BGAPitchmm(mil) | 0.4 | 0.4 | 0.4 | |
| PHMin.Hole rlng um(mil) | 75(3) | 62.50(2.50 | 62.50(2.50 | |
| Line Width control | <2.5mil(mil) | ±0.50 | ±0.50 | ±0.50 |
| 2.5mil≤L/W<4mil | ±0.50 | ±0.50 | ±0.50 | |
| ≤3mil(mil) | ±0.60 | ±0.60 | ±0.60 | |
| SolderMask Registration um(mil) | ±25 | ±25 | ±25 | |
| Solder masThickness | Lines Minum(mil) | 10(0.40) | 10(0.40) | 10(0.40) |
| Lines Minum(mil) | 30(1.20) | 30(1.20) | 30(1.20) | |
| CopperMinum(mil) | 10(0.40) | 10(0.40) | 10(0.40) | |
| CopperMax um(mil) | 30(1.20) | 30(1.20) | 30(1.20) | |
| Mln.Solder Mask opening um(mil) | 250(10) | 200(8) | 200(8) | |
Structure | Stacking layer by layer | 5+N+5 | 6+N+6 | 7+N+7 |
| Sequenetlal Bu il-up | 42Any Layer | 46Any Layer | 60Any Layer | |
| Stacking layer by layer | N+N | N+N | N+N | |
| N+X+N | N+X+N | N+X+N | ||
| Sequenetlal Lamination | 4+(N+X+N)+4 | 5+(N+X+N)+5 | 6+(N+X+N)+6 | |
Multi-layer stepped structure | Multi- layer stacking | 5+N+5 | 6+N+6 | 7+N+7 |
| Sequenetlal Bu il-up | 12Any Layer | 16Any Layer | 18Any Layer | |
| Multi- layer staircase | 4 steps | 6 steps | 6 steps | |
| Mechanical depth control drilling depth | 2.0mm±0.08mm | 2.0mm±0.08m | 2.0mm±0.08m | |
| Laser controlled depth drilling | 0.6mm±0.08mm | 0.8mm±0.08mm | 1.0mm±0.08mm | |
/Min.HOle/Land um(mil) | linner um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
| Outer um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
Minimumburiedholediameter/solder pad | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | |
| SUBDielectricThic kness | Mln.um(mil) | 38(1.5) | 32(1.3) | 25(1.0) |
| Max.um(mil) | 125(5) | 125(5) | 125(5) | |
| SKipvia | Yes | Yes | Yes | |
| Via on hole(LaserViaon BuriePTH | Yes | Yes | Yes | |
| Laser Hole Filling | Yes | Yes | Yes | |
Resin plug hole plate thickness | Min mm(mil) | 0.35 | 0.35 | 0.35 |
| Max mm(mil) | 3.2 | 3.2 | 3.2 | |
| Min mm(mil) | 125(5) | 110(4.50) | 110(4.50) | |
| Routing Depth control Accuracy um(mil) | ±50um(mil) | ±50um(mil) | ±50um(mil) | |
| Outine NC Rcuting Tolerance um(mil) | 75(3) | 75(3) | 75(3) | |
Type of surface Finishing | OSP、 Sinking gold, lead-free tin, lead tin, electroplated gold fingers, electroplated gold (electroplated nickel hard gold, electroplated nickel soft gold), gold fingers+sinking gold, spray tin+gold fingers, OSP+electroplated gold, OSP+sinking gold, electroplated silver, electroplated silver, electroplated tin, gold coated silver, nickel free electroplated thick gold, nickel free electroplated thick silver, tin silver copper, OSP+gold fingers | |||
| EN Thickness Control(um) | >0.025-0.1um | >0.025-0.1um | >0.025-0.1um | |
| OSOSP Thickness(um) | >0.20-0.50um | >0.20-0.50um | >0.20-0.50um | |
| Ni Thickness(um) | >105? 250um | >105? 250um | >105? 250um | |
| Platinum thickness control | >0.025-5um | >0.025-5um | >0.025-5um | |
| Lead/lead- free tin spraying thickness | >105? 150um | >105? 150um | >105? 150um | |
| Electrosilver | >105? 140um | >105? 140um | >105? 140um | |
| Thickness control of sinking silver | >105? 140um | >105? 140um | >105? 140um | |
| Tin thickness control | >105? 140um | >105? 140um | >105? 140um | |
Min TestPAD | E/Tum(mil) | 75(3) | 75(3) | 75(3) |
| E/Tum(mil) | 50(2) | 50(2) | 50(2) | |
| E/Tum(mil | 25(1) | 25(1) | 25(1) | |
| E/Tum(mil) | 150（6） | 150（6） | 150（6） | |
lmpedanceContro lTolerance | ≧50ohm | ± 10% | ±8% | ±8% |
| ≦50ohm | ±50ohm | ±50ohm | ±50ohm | |
| Finished board | Plate thickness≧0.15mm | ≧ ± 10% | ≧ ± 10% | ≧ ± 10% |
| Plate thickness≧0.15mm | ≧ ±0.075% | ≧ ±0.075% | ≧ ±0.075% | |
| Warpage | ≤0.7% | ≤0.5% | ≤0.5% | |
| The above are the conventional production skills of Chaosheng Group Company, and there are any unclear points. Please further communicate with our specialized technical personnel, and we will be happy to serve you! Welcome to our guide! |
供应商信息
深圳市超盛电子科技有限公司 进入首页
超盛集团成立于1968年12月，2012年实施股份制改革，公司以高端印制电路板生产为主，集成设计、开发、加工、生产、销售、外贸为一体，1982年成立日本スーパー盛岡奇株式会，2001年成立浙江坤蓥电子科技有限公司、2007年成立深圳市超盛电子科技有限公司、2010年成立深圳市金林新能源有限公司等四家子公司，以及分布在法国、英国、德国、日本、欧洲、香港等国家及地区多处经销商，是中国目前***实力的（日、港、中）合资电路板制造商之一；特色产品包括：HDI(高密度互连)板、高多层、微波高频、厚铜、金属基、软板、陶瓷、软硬结合板等，产品广泛应用于通讯设备、智能系统、新能源、医疗器械、检测系统、航空航天、LED、通信、汽车、家用电子产品等高科技领域，集团年产值超过千亿，印制电路板年产值350亿以上，月产能45万平米。 公司品质方针质量方针： 服务求诚！质量求精！以质量求生存！ 质量目标：全员参与，科学管理、客户至上、品质***、******品质 质量承诺： 产品质量***符合顾客标准，如发生产品质量不合格，对客户损失给予必要赔偿；售后服务承诺：对于客户信息反馈给予认真对待，及时回复，积极处理以客为尊我们深信只有用心面对和迎接每个挑战，才能为顾客提供优质的产品和服务。 企业生存之道: 以质量求生存！以信誉求发展！从管理中创***！的品质！的服务！***的价格！树立超盛形象！给我一次机会！还您一个奇迹。 公司企业文化使命： 为世界电子信息产业提供高品质的线路板（PCB、FPC）和及时、满意的服务 愿景： 成长为世界***的线路板服务企业，为客户、员工、社会、投资者创造价值核心价值观 管理原则：诚信、互助，进步、分享. 以客户为中心: 以市场为导向公司继续关注环保和清洁生产,坚持继续发展战略，坚持中国和全球环境会议。我们拥有***环保体系和设施，可以处理废物，减少浪费，减少能源。 秉承“为世界电子信息产业提供高品质的线路板和及时满意的服务,以市场为导向”的核心价值观，为客户、员工、社会、股东创造价值”这一崇高愿景。 我们的宗旨是客户***，交货准时，持续改进，客户满意，提供***的服务和质量。您的满意是我们的追求！欢迎合作的厂商前来我公司指导！我希望你能给我们一个能保贵意见，也希望贵公司能给我们一个长期合作的好机会！
点击查看>| 企业类型 | 股份合作企业 | 注册资本 | 500.00万人民币 |
| 公司注册地址 | 中国广东深圳市龙岗区爱联社区石岗圩路100号 | 统一社会信用代码 | 91440300359776622G |
| 登记机关 | 深圳工商局 | 法定代表人 | 李先生 |
| 公司成立日期 | 2002-01-28 | 营业期限 | 长期有效 |
| 经营范围 | 主要产品类型及结构 无卤素材料、高频材料、高速材料、金属材料、环保线路板、盲埋孔线路板、高导热铝基、热电分离铜基、PDU母排、铁基以及金属基（芯）混压板、埋铜块板、镶嵌铜块板、埋阻埋容板、超薄BT板、陶瓷基板、特氟龙Teflon(PTFE)板、高频混合介质板、高速板、差分阻抗控制板、厚铜板、高低铜板、阶锑厚铜板、镀厚金板，高阶HDI，任意阶（交叉盲埋）Anylayer、双面FPC、多层FPC、HDIFPC、软硬结合、软硬结合HDI、超长超大尺寸板、超厚板、超小尺寸板、集成电路IC、BGA封装基板、特殊厚铜10CM多层等。 主要表面工艺： 沉金、电镍金、沉金+OSP、电镍金+沉金、电镍金+沉金+OSP、电金+OSP、沉金+金手指、OSP+金手指、无铅喷锡、无铅喷锡+沉金、无铅喷锡+金手指、有铅喷锡、OSP、沉锡、沉银 主要材料有： Rogers、Arlon、Taconic、TP-2、Megtron、Neclo、Isola、F4B、台耀TUC、台光EMC、腾辉VT、生益SY、联茂ITEQ、南亚NOUYA、杜邦Kapton、台虹、宏仁、新扬、新日铁、铁氟龙、雅森、日本松下、日本RCC、日本三井、美国3M、贝格斯、雅隆、泰康尼等。 | ||
产品推荐
-
面议
-
面议
-
面议
-
面议
-
面议
-
面议
-
面议
-
面议
推荐产品
-
面议
-
面议
-
面议
-
面议
本页信息为深圳市超盛电子科技有限公司为您提供的"32层埋槽金属包边大尺寸电路板PCB"产品信息，如您想了解更多关于"32层埋槽金属包边大尺寸电路板PCB"价格、型号、厂家请联系厂家，或给厂家留言。 进入店铺
在线留言
